Sales Engineer (Wire Bonding / Semiconductor Packaging Malaysia)

Location: Malaysia (covering Malaysia & SEA)
Reporting to: Regional PM
Type: Full-time

Company Background

The company specializes in ceramic bonding tools and advanced ceramic products used in semiconductor packaging and have manufacturing and R&D bases in Shenzhen and Hefei.

Role Overview

This role focuses on promoting and supporting ceramic bonding wedges used in wire bonding applications, especially for Semiconductor Assembly & Packaging customers in Malaysia and Southeast Asia.

The position combines technical understanding + customer interaction + commercial execution.

Key Responsibilities

1. Sales & Market Development

• Promote bonding wedge products to semiconductor customers in Malaysia and nearby markets

• Identify new business opportunities and expand customer base

• Maintain long-term customer relationships

• Regularly visit customers, understand bonding process requirements and challenges

• Collect market and competitor information

2. Technical Support

• Provide bonding-tool introductions and product presentations

• Participate in technical discussions and bonding evaluations

• Understand customer bonding parameters, materials and process flow

• Support customers in product selection, evaluation and adoption

• Coordinate technical support with HQ engineering team

• Provide pre-sales and after-sales application support

Qualifications

• Diploma/Bachelor degree or above (engineering background preferred)

• Experience in semiconductor packaging or bonding (Wire Bond, Die Bond, etc.)

• Knowledge of bonding tools or bonding process strongly preferred

• Strong communication ability and willingness to interact with customers

• Able to understand technical requirements and translate to product solutions

Preferred Experience

• Wire Bond process (Thermosonic bonding / wedge bonding)

• FOA / assembly & test environment

• Process optimization, DOE, yield improvement

• Customer support exposure

Soft Skills

• Technical curiosity and willingness to learn new products

• Strong communication and problem-solving ability

• Comfortable interacting with customers and suppliers

• Self-driven and able to independently manage activities

Travel

• Mainly domestic Malaysia customer visits

• Occasional Southeast Asia travel

Why This Role

• Growing application in semiconductor packaging

• Advanced ceramic bonding tools with high technical depth

• Opportunity to work closely with customers and industry leaders

• Suitable for engineers who want to move toward technical sales / application support

Interview Process

• 2 rounds