Systems Architecture & Integration Engineer-REMOTE

Legrand has an exciting opportunity for a Systems Architecture & Integration Engineer to join the Power & Thermal Management Division. This is a remote position reporting to Reno, NV. The Systems Architecture & Integration Engineer is responsible for defining and driving next-generation hyperscale data center infrastructure solutions aligned with Open Compute Project (OCP) standards and emerging AI workloads. This role serves as the technical liaison between hyperscale customers, industry partners, OCP workgroups, internal engineering teams and business units to ensure future product architectures meet evolving market, technology, and customer requirements. The successful candidate will provide technical leadership across power distribution, liquid cooling, platform management, networking, and rack-scale infrastructure while translating emerging technologies into scalable, manufacturable products. This role requires a broad systems engineering perspective and the ability to anticipate industry trends, influence technology roadmaps, and drive cross-functional execution.

Salary Range: $140,000-$185,000 annually

Benefit Highlights: LNCA offers comprehensive medical, dental, and vision coverage, as well as distinctive benefits like a high employer 401K match, paid time off (PTO) and holiday pay, short-term and long-term disability benefit plans, above-benchmark paid maternity and parental leave, bonus opportunities in accordance with the Company’s incentive plans, paid time off to volunteer, and an active/growing Employee Resource Group network.

Technology Strategy & Architecture

• Develop strategic technology roadmaps aligned with customer and market requirements.
• Define next-generation OCP-compliant rack, power, thermal, and infrastructure architectures.
• Evaluate emerging technologies, standards, and industry trends impacting AI and hyperscale data centers.
• Lead technology assessments, proof-of-concept activities, and competitive benchmarking efforts.
• Translate customer and industry requirements into product and system architecture specifications.

OCP & Industry Leadership

• Participate in Open Compute Project (OCP) workgroups and industry consortiums.
• Collaborate with hyperscale customers, ODMs, OEMs, silicon vendors, and strategic suppliers.
• Contribute to future standards and technology direction through industry engagement.
• Serve as a technical advisor to engineering, product management, sales, and executive leadership teams.

Power & Thermal Infrastructure

• Develop rack-scale power architectures supporting 48VDC, ±400VDC, 0-800VDC, and future HVDC systems.
• Define power distribution strategies including busways, busbars, Remote Power Panels (RPPs), and intelligent power monitoring.
• Lead integration of high-density power systems supporting AI deployments exceeding 1MW per rack.
• Evaluate and integrate advanced cooling technologies including Direct Liquid Cooling (DLC), Coolant Distribution Unit (CDUs), rear-door heat exchangers, and immersion cooling.

Systems Integration & Product Development

• Lead architecture reviews, requirements development, risk assessments, and design validation activities.
• Collaborate with manufacturing and test organizations to establish validation strategies and qualification plans.
• Identify technical risks early and develop mitigation strategies to support successful product execution.
• Perform other duties as assigned.

Education:

• Bachelor’s degree in electrical engineering, Mechanical Engineering, Computer Engineering, Computer Science, or related technical discipline; or an equivalent combination

Experience:

• A minimum of 10 years of experience in data center infrastructure, power systems, systems architecture, or related engineering fields.
• Strong knowledge of electrical power conversion and distribution systems.
• Experience leading complex, cross-functional technical initiatives.

Preferred:

• Advanced degree in technical discipline.
• Direct experience with Open Compute Project (OCP) initiatives and specifications.
• Experience supporting hyperscale customers and AI infrastructure deployments.
• Active participation in standards organizations or industry workgroups.

Technical Expertise to Reference

Power Infrastructure

• High-density AI infrastructure
• High-current busbar systems
• Rack PDUs and intelligent power distribution
• 48VDC, ±400VDC, 0-800VDC and HVDC architectures
• Remote Power Panel
• Solid State Transformers
• Battery backup systems (BBS)
• Rack-scale power delivery

Thermal & Liquid Cooling

• Direct Liquid Cooling (DLC)
• Coolant Distribution Units (CDUs)
• Rear-door heat exchangers
• Immersion cooling technologies
• Thermal modeling and optimization

Networking & AI Infrastructure

• OCP networking architectures
• GPU and AI cluster infrastructure
• High-speed interconnect technologies
• Optical networking
• Rack-scale system architectures

Platform Management

• OpenBMC
• Redfish and DMTF standards
• Rack-level telemetry and monitoring
• Infrastructure orchestration and management software
• Remote diagnostics and lifecycle management