Wafer Fab Process Engineer

Job Summary
Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.

Key Responsibilities

• Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).

• Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.

• Drive new process integration (NPI) and process transfer to high-volume manufacturing.

• Perform root cause analysis and implement robust corrective/preventive actions.

• Define process control plans, SPC strategies, and OCAP execution.

• Collaborate cross-functionally with equipment, integration, quality, and R&D teams.

• Mentor junior engineers and technicians.

• Interface with suppliers on process and material improvements.

Qualifications

• Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).

• At least 5 years of semiconductor wafer fab process experience in thin film deposition - metal/passivation and/or thermal - oxidation, diffusion, implantation.

• Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.

• Demonstrated leadership in cross-functional technical projects.

• Strong analytical, problem-solving, and communication skills

Preferred

• PhD in Engineering (Electrical, Chemical, Materials, or related).

• Six Sigma certification (Green/Black Belt).

• Experience supporting 4" to 6" wafer scaling or equivalent manufacturing transition.