Wafer Bond Process Engineer

Wafer Bond Process Engineer

Description -

HP is seeking a highly motivated Process Engineer to provide technical leadership for wafer bonding technologies supporting both high-volume manufacturing and next-generation MEMS product development. This role is responsible for sustaining and improving existing wafer bonding processes while leading the development, qualification, and implementation of new bonding technologies, materials, equipment, and manufacturing capabilities.

The successful candidate will serve as the technical owner for wafer bonding processes, partnering closely with Operations, Equipment Engineering, Integration Engineering, Product Engineering, Quality, and external suppliers to drive manufacturing excellence, technology advancement, and operational performance. The role requires strong expertise in wafer bonding processes, process development, project leadership, capital equipment acquisition, and process qualification.

• Serve as the technical owner for wafer bonding processes supporting MEMS manufacturing.
• Sustain high-volume production processes through monitoring, troubleshooting, and continuous improvement activities.
• Drive process stability, yield improvement, defect reduction, cycle time reduction, and cost optimization.
• Lead root-cause investigations for process excursions and implement corrective and preventive actions.
• Develop and maintain process specifications, operating procedures, work instructions, control plans, and FMEA documentation.

• Demonstrated expertise in wafer-to-wafer and wafer-to-carrier bonding technologies, including direct, adhesive, anodic, oxide, and ionic bonding methods, supporting MEMS, sensors, photonics, biochips, advanced packaging, and heterogeneous device integration applications.
• Experience in surface preparation and pre-bond cleaning processes including plasma treatments, wet cleans, and dehydration bakes to achieve high bond strength and low defectivity.
• Experience with bond alignment, bond tool operation, thermal cure processes, and post-bond processing.
• Utilize metrology, IR inspection, and analytical techniques to evaluate bond integrity, alignment accuracy, defectivity, and interface quality.
• Troubleshoot bonding-related challenges including voids, delamination, particles, alignment issues, and interface defects.
• Drive process characterization, optimization, and margin studies using SPC, DOE, capability analysis, yield analytics, and statistical methodologies.

• Lead development of new bonding processes from concept through manufacturing implementation.
• Define process windows, characterize critical process parameters, and establish robust manufacturing controls.
• Design and execute DOE studies, capability analyses, and process characterization plans.
• Evaluate emerging materials, equipment technologies, and manufacturing approaches to support future technology roadmaps.
• Support New Product Introduction (NPI), technology transfers, and scale-up activities from development to production.

• Lead cross-functional projects involving process improvements, technology development, equipment implementation, and manufacturing capacity expansion.
• Develop project plans, schedules, risk assessments, resource requirements, and milestone tracking.
• Coordinate efforts across Manufacturing, Quality, Equipment Engineering, Integration Engineering, Purchasing, Supply Chain, and external partners.
• Communicate project status, risks, mitigation plans, and technical recommendations to leadership and stakeholders.
• Drive execution of strategic initiatives that improve manufacturing capability, product quality, cost, and operational performance.

• Define technical requirements and specifications for new manufacturing equipment and process capabilities.
• Lead capital equipment projects including vendor evaluations, technical assessments, business justification development, factory acceptance testing, source inspections, installation, and production release.
• Partner with suppliers and internal stakeholders to ensure successful deployment of new tools and technologies.
• Establish equipment acceptance criteria, qualification plans, and performance metrics.
• Support capacity planning and long-term manufacturing capability development initiatives.

• Lead qualification of new processes, materials, equipment, and process changes.
• Develop qualification strategies, protocols, and reports to ensure manufacturing readiness and process robustness.
• Utilize statistical methods, gauge capability studies, SPC, and risk-based methodologies to support validation efforts.
• Execute process capability assessments and manufacturing readiness reviews.
• Drive implementation of validated solutions into production while ensuring compliance with quality system requirements.

• Bachelor’s degree in Chemical Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or related engineering discipline.
• 5+ years of semiconductor, MEMS, advanced packaging, photonics, sensor manufacturing, or related process engineering experience.
• Demonstrated experience with wafer bonding technologies in manufacturing and/or development environments.
• Strong understanding of process control methodologies including SPC, DOE, process capability analysis, statistical data analysis, and process qualification.
• Experience troubleshooting complex manufacturing processes and implementing sustainable solutions.
• Proven track record leading technical projects across cross-functional organizations.
• Experience leading process development efforts from concept through manufacturing deployment.
• Experience supporting capital equipment acquisition, installation, and qualification.
• Strong written, verbal, and presentation communication skills.
• Demonstrated analytical problem-solving and technical leadership capabilities.

• Advanced degree (M.S. or Ph.D.) in Engineering, Materials Science, Physics, or related discipline.
• Experience with MEMS manufacturing technologies and cleanroom operations.
• Experience supporting sensor, photonics, biochip, advanced packaging, or heterogeneous integration applications.
• Experience leading capital equipment acquisition and implementation projects.
• Experience with process qualification, validation, and manufacturing readiness activities.
• Knowledge of FMEA, Control Plans, risk-based process development, and quality management systems.
• Familiarity with wafer inspection, metrology, failure analysis, and materials characterization techniques.
• Experience engaging with external suppliers and equipment vendors.
• Formal project management experience leading multidisciplinary engineering teams.
• Experience supporting technology development, NPI, and process transfers into production.

• Technical leadership and influence across organizations.
• Strong project and program management skills.
• Ability to lead through ambiguity and drive execution.
• Effective collaboration with internal and external stakeholders.
• Continuous improvement mindset.
• Strategic thinking balanced with hands-on technical execution.
• Strong data analysis and decision-making skills.
• Passion for developing innovative manufacturing solutions and advancing next-generation technologies.

The pay range for this role is $93,400 to $143,800 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including;
• 4-12 weeks fully paid parental leave based on tenure
• 11 paid holidays
• Additional flexible paid vacation and sick leave (US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

25%

Relocation -

Yes

Equal Opportunity Employer (EEO) -

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"