Staff Product Manager - Data Center High-Speed Connectivity & AI Infrastructure

Company:

Qualcomm Technologies, Inc.

Job Area:

Operations Group, Operations Group > Product Management

General Summary:

Join Qualcomm's Data Center Business Unit and help define the next generation of high-performance connectivity solutions powering hyperscale AI infrastructure.

As a Staff Product Manager, you will drive product strategy, roadmap definition, customer engagement, and execution for high-speed connectivity technologies that enable AI scale-up and scale-out systems. Working across architecture, engineering, ecosystem partners, and hyperscale customers, you will help shape solutions spanning scale-up fabrics, high-speed I/O, optical networking, and rack-scale infrastructure. Qualcomm's connectivity portfolio includes advanced Serdes, optical, PCIe, and next-generation interconnect technologies that support scalable AI systems and custom silicon platforms.

Product Strategy & Roadmap

• Define product strategy and multi-generation roadmaps for high-speed connectivity solutions supporting AI and cloud infrastructure.
• Develop market requirements, customer use cases, competitive positioning, and business cases for next-generation connectivity technologies.
• Identify emerging industry trends and customer requirements across AI networking, scale-up fabrics, scale-out architectures, chiplet ecosystems, and rack-scale infrastructure.
• Drive platform and ecosystem strategies that enable broad adoption across custom silicon and AI infrastructure deployments.

Customer Engagement

• Engage directly with customers, ecosystem partners, and industry consortiums to understand future connectivity requirements.
• Translate customer needs into product requirements and roadmap priorities.
• Support technical workshops, architecture reviews, customer briefings, and executive engagements.
• Develop compelling product value propositions and positioning for strategic customer opportunities.

Architecture & Cross-Functional Leadership

• Collaborate closely with architecture and engineering teams to define system-level connectivity requirements and product capabilities.
• Drive alignment across silicon, software, systems, packaging, and infrastructure organizations.
• Provide product leadership for emerging interconnect technologies including die-to-die connectivity, chiplet ecosystems, scale-up fabrics, high-speed I/O, and optical networking solutions. Qualcomm's platform strategy includes advanced electrical and optical interconnect technologies as key building blocks for future data center platforms.
• Balance performance, scalability, power efficiency, cost, ecosystem adoption, and business objectives when defining product direction.

Business & Execution

• Develop business cases, investment recommendations, pricing strategies, and customer engagement plans.
• Support product planning from concept through market deployment and adoption.
• Drive cross-functional execution across architecture, engineering, operations, sales, and marketing.
• Track product success using measurable business, customer, and execution metrics.

This is an office based position located in Santa Clara, CA and is expected to comply with the company's onsite work policy.

Minimum Qualifications:

• Bachelor's degree in Engineering, Information Systems, Computer Science, Humanities, or related field.
• 5+ years of Product Management or related work experience.

Preferred Qualifications:

• 10+ years of experience in semiconductor, networking, connectivity, or AI infrastructure markets.
• Strong understanding of high-speed connectivity technologies including PCIe, Ethernet, optical interconnects, die-to-die communication, and chiplet ecosystems.
• Experience with AI infrastructure, hyperscale data centers, HPC systems, or cloud architectures.
• Understanding of scale-up and scale-out system architectures used in AI and machine learning deployments.
• Familiarity with advanced packaging, heterogeneous integration, and high-bandwidth interconnect solutions.
• Experience driving products from concept through deployment.
• Strong financial, analytical, and market evaluation capabilities.
• Proven ability to influence and lead cross-functional teams without direct authority.
• Excellent written, verbal, and executive communication skills.
• Experience working directly with hyperscale customers, strategic partners, or industry standards organizations.

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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits:

$208,200.00 - $312,200.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.