Sr. Supplier Quality Engineer, OSAT

About the job:

Excursion Management & Problem Solving

Lead 8D investigations: Customer or In-Process quality complaint. Own the corrective and preventive action (CAPA) cycle for quality issues originating during assembly or final test.

Conduct failure analysis: Coordinate with OSAT engineering to analyze production line, internal screening, or customer field failures.

Conduct audit: Perform on-site audit as verification at supplier facilities to ensure corrective actions are physically and permanently implemented.

Process Control & Continuous Improvement

Monitor statistical data: Continually track supplier Statistical Process Control (SPC) data, Out-of-Control Action Plans (OCAPs), and real-time yield performance trends monitor for improvement.

Deploy quality structure frameworks: Implement advanced quality tools including Failure Mode and Effects Analysis (FMEA).

Measurement Systems Analysis (MSA), APQP, SPC and Control Plan  frameworks.

Drive supplier scorecards & QIP: Track supplier Key Performance Indicators (KPIs), generate quality ratings, and hold regular performance review meetings and QIP

Supplier Audits & Qualification

Execute facility audits: Conduct routine quality management system (QMS), ESD, and focus process technical line audits using industry standards, i.e. ISO9001|IATF16949|VDA6.3 Process||

Qualify/Certify New supplier site or line: Oversee the production readiness, baseline qualification, and technical change management of new OSAT suppliers.

Change Control Management : Validate Process Change Notices (PCNs) submitted by supplier to prevent unexpected yield or reliability issues.

About you:

Education & Core Experience

Degree requirements: Bachelor’s degree in Electrical Engineering, Materials Science, Chemical Engineering, or a related technical discipline.

Industry experience: Usually 5 to 8+ years within backend semiconductor manufacturing, packaging engineering, or supplier  quality management.

Technical Mastery

Backend processes: Practical knowledge of backgrind, sawing, die attach, wire bonding, flip-chip, molding, underfill, form singulation, platimg. wafer level bumping, SiP and final test for package/ module methodologies.

Materials knowledge: Clear knowledge of how substrates, PCB, leadframes, epoxy, molding compound, and solder ball, solder impact reliability.

Sector standards: Familiarity with specialized quality frameworks, particularly ISO 9001, IATF 16949 (automotive), or medical compliance.

Failure mechanisms: Strong understanding of packaging failure modes like package cracking, popcorn effects, corrosion, and solder joint fatigue.

Reliability testing: Familiarity with backend qualification standards such as JEDEC (e.g., MSL, HAST, HTOL, Temperature Cycling).

Automotive standards: Proficiency in AEC-Q100 requirements and IATF 16949 core tools (PPAP, MSA, SPC, FMEA) if supporting automotive lines.

Expected Working Conditions

High travel volume: Demands up to 30% to 40% travel for sudden on-site crisis/quality excursion management and intensive multi-day to support company’s supplier/customer audits at factory.

Global alignment: Requires routine interaction with members across international boundaries and varying time zones to sync with global operation/engineering via remote meeting/conference calls

Location: On-site at office and required minimal supervision.