Senior System and Hardware Validation Engineer

Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

The Qualcomm Data Center AI System Hardware and Validation Engineering team develops rack-level AI inference solutions for next-generation, liquid-cooled data centers. As the organization continues to grow, the team is seeking experienced Technical Leads to help deliver the next wave of innovative AI products.

Join a world-class, multidisciplinary team that is shaping the future of AI infrastructure. You will be working alongside industry-leading experts across the entire AI infrastructure stack—from silicon, systems architecture, networking, and distributed computing to machine learning platforms and large-scale AI deployment. Our collaborative and fast-paced environment offers unparalleled opportunities for learning, innovation, and professional growth, empowering you to solve some of the most challenging problems in the industry

As a System Hardware and Validation Technical Lead, you will partner with SoC, software/firmware, rack-level system design, and manufacturing teams. Collaborating closely with peer leads, you will ensure program activities are well planned, tracked, and executed against phase-gate milestones from concept through production.

Responsibilities

• Lead execution for next-generation Qualcomm rack-scale designs within a matrixed organization spanning multiple teams and global sites.
• Define and manage requirements, scope, schedules, and deliverables in alignment with engineering teams, partners, and stakeholders.
• Own rack-level integration plans across compute nodes/accelerators, PCIe fabrics, networking, storage, power delivery, cooling, and rack management/telemetry.
• Drive firmware/software/hardware co-design execution, aligning BIOS/BMC/Redfish/telemetry requirements with hardware schedules and validation gates.
• Lead cross-functional design reviews and readiness reviews (architecture, schematic/layout, SI/PI, thermal, mechanical, firmware, manufacturing), and close actions to schedule.
• Coordinate platform-level debug and instrumentation (telemetry, logging, health monitoring) to accelerate failure analysis and improve observability.
• Establish and run triage mechanisms (issue intake, prioritization, defect metrics) and drive issues to root cause, corrective action, and verified closure.
• Define and track program-level KPIs (schedule health, build quality, defect trends, coverage, yield, reliability) and publish executive dashboards and weekly program reviews.
• Identify program risks, drive mitigation plans, and manage scope changes while proactively communicating status and decisions to stakeholders.

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

Preferred Qualifications:

• Master’s degree in computer science/engineering, electrical engineering, or a related field.
• 3+ years of experience in systems or hardware engineering, hardware project lifecycle management, and technical product/program management.
• Experience with rack level systems and components.
• Proven experience collaborating with technical teams to develop systems, solutions, and products.
• Experience managing technical programs across cross-functional teams, establishing processes, and coordinating release schedules, and working in large, matrixed organizations.
• Demonstrated proficiency with Microsoft Office applications, SharePoint, JIRA/Confluence, and other defect-tracking tools.
• Persuasive communication, organizational, coordination, multi-tasking, and documentation skills.
• Experience with server technologies, including board design, SIPI, thermal and mechanical aspects, BIOS, BMC, and networking.
• Familiarity with Agile methods and practices.
• Experience working with CMs, OEMs, ODMs, and suppliers in product development.
• Strong cross-functional communication skills, with experience managing complex program lifecycles, building sustainable processes, and coordinating release schedules.

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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits:

$117,800.00 - $176,600.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.