(Senior) PIC Design Engineer - Architecture & Fiber Coupling (f/m/d)

The future of AI computing builds on light. Q.ANT is building photonic processing systems that compute with light - delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications. Q.ANT’s photonic integrated circuits are at the heart of this technology.

You will drive the design, development, and optimisation of advanced PIC components - with a particular focus on state-of-the-art fiber-to-chip coupling and photonic packaging - driving solutions from initial concept through layout, fabrication, and production-ready integration.

As a technical lead for specific PIC components, you will drive innovation across the full photonic integration lifecycle, define design methodologies, and coordinate cross-functional teams from concept to production. Your expertise in fiber-to-chip coupling and packaging will directly distinguish Q.ANT’s photonic solutions and shape the company’s technology roadmap.

Location: Stuttgart, Germany
Type: Permanent employment, full-time
Work mode: Onsite with max. 1 day remote work per week

What You Will Do

• Drive the development of state-of-the-art fiber-to-chip coupling solutions for industry environments - driving mode matching, loss budget optimisation, and packaging integration from component design through production-ready delivery• Lead the design, prototyping, and validation of specific photonic chip components - from concept through layout, tape-out coordination, fabrication, and packaging - ensuring all deliverables meet performance specifications and schedule targets
• Implement photonic computing architectures on chip; drive innovation and new technology development in the PIC domain, proposing novel components and integration strategies that feed directly into Q.ANT’s product and technology roadmap
• Coordinate cross-disciplinary engineering projects (design, development, integration, testing) from concept to production - working closely with packaging, test, and foundry teams; collect and consolidate specifications from stakeholders and translate them into circuit definitions
• Mentor junior engineers and technicians; provide technical guidance and ensure effective collaboration across all project phases
• Present complex technical findings and design decisions to both technical peers and executive-level stakeholders with clarity and precision

Required:

• Strong academic foundation in Photonics, Electrical Engineering, Applied Physics, or a related field (Master’s degree or PhD); equivalent industry experience considered
• 3+ years of proven hands-on experience in photonic design, layout, and tape-out coordination
• In-depth expertise in fiber-to-chip coupling interfaces, including mode matching, packaging constraints, and loss budget management
• Advanced proficiency in photonic simulation tools (e.g., Lumerical/Ansys, RSoft, Photon Design Suite, or equivalent) with demonstrated ability to produce design-ready simulation outputs
• Solid practical experience with a PIC-specific layout tool (e.g., Nazca, GDSFactory, or Luceda) and advanced Python skills applied to photonic design workflows - automation, simulation scripting, and data analysis
• Solid grounding in optical device characterization techniques and interpretation of optical/electrical test data
• Proven ability to coordinate cross-functional technical investigations across teams without formal authority and strong communication skills at both technical and executive level
• Proven track record collecting and consolidating specifications from stakeholders and translating them into circuit definitions
• Fluent English; German is beneficial - working language in the team is English

Nice to have:
None of the following are required - they are genuine bonuses and we do not expect any one candidate to bring all of them:

• First experimental experience with TFLN / LNOI
• Understanding of AI or high-speed optical communication system requirements for PICs
• Knowledge of mixed-signal and photonic/electronic co-packaging challenges
• Experience with foundry collaboration and process transfer to external manufacturing partners

• Make impact at scale: Your verification and integration work directly determines which PIC technologies are production-ready - high stakes, high impact from day one
• Work on the leading edge: Photonic integrated circuit technologies that are shaping the next decade of computing
• Own your work from day one: Shape characterization strategies, integration workflows, and roadmap inputs on your own, with direct impact on product success
• Fast-track your growth: Work on challenges with few industry precedents - every problem you solve becomes new institutional knowledge and potentially industry-defining IP
• World-class team: Collaborate alongside a passionate, international, cross-functional team of experts in photonics, electronics, and packaging
• Direct access to leadership: Work closely with the company’s founders, including CEO Dr. Michael Förtsch, and the Q.ANT senior leadership team
• Collaborative culture: Innovative work environment that values technical excellence, open communication, and pragmatic problem-solving
• Be part of history: Join at the inflection point where photonic computing transitions from research to mainstream - your contributions will shape this transformation

We are looking for a hands-on senior engineer who gets energized by designing and delivering advanced PIC components, pioneering fiber-to-chip coupling solutions, and directly shaping next-generation photonic technology.

Ready to push the boundaries of what photonic integrated circuits can do?
We are looking forward to receiving your application!

Q.ANT is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.