Semicon Etch Process Engineer

Summary

To lead the development, optimization, and stabilization of plating and etching processes for advanced semiconductor packaging, contributing to mass production readiness, yield improvement, and customer-specific technical solutions.

Job

Develop and optimize electroplating, seed etching, and PR stripping processes

Design and improve processes for TSV, RDL, Cu pillar, and micro bump formation

Evaluate and introduce new materials and equipment for plating/etching process integration

Conduct pre-production process validation and yield stabilization

Perform DOE planning and analyze experimental data using statistical tools (e.g., SPC, Minitab, JMP)

Develop customized processes and provide technical support for customer programs

Set up equipment and optimize operating conditions in coordination with vendors

Troubleshoot quality issues across plating and etching processes

Support development of advanced packaging technologies including 2.5D, fan-out, and SiP

Supports high-volume semiconductor packaging processes in plating and etching

Contributes directly to process yield, quality improvement, and customer technical satisfaction

Drives technical innovation in advanced packaging technologies in alignment with global customer programs

Requirement

Bachelor's degree or higher in Engineering or Science (e.g., Materials Science, Chemistry, Chemical Engineering, Electronics, Advanced Materials)

Minimum 3 years of hands-on experience in plating, etching, or stripping processes in semiconductor manufacturing

Fundamental understanding of advanced semiconductor fabrication and integration processes

Strong skills in experiment design, statistical data analysis (e.g., SPC, Minitab, JMP), and technical reporting

Proficiency in preparing technical documentation and delivering presentations

Basic knowledge of semiconductor process equipment and materials

Experience in key back-end processes such as TSV, RDL, and micro bump

Knowledge of advanced packaging technologies including 2.5D, fan-out, and flip-chip

Familiarity with related processes such as photo, chip attach, and underfill

Proven experience in joint development projects with global customers

Hands-on collaboration with material or equipment suppliers for co-evaluation or integration

Expertise in process reliability testing (e.g., thermal cycling, HAST)

Experience in process automation or smart fab environments

Working proficiency in tools such as AutoCAD or ANSYS

In-depth understanding of etch/strip conditions for back-end photoresist materials

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to [email protected] stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

EA License Number: 02C4944

EA Personnel Reg nos R1110618

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