Project Manager Project Management

Your Role

Key responsibilities in your new role

• Drive Package assembly and Test development projects under the OSAT (Outsourced Assembly & Test) function to enable turnkey/full turnkey of high volume manufacturing for Infineon's product, under Connected and Secure Systems (CSS) business division, in our subcontractors manufacturing sites present globally
• Undertake low to medium complexity projects as per the project classification and category guidelines defined by Infineon
• Identify package level cost down opportunities and drive cost down projects
• Initiation, planning, execution, control and closure of package assembly and test development as well change management projects within the committed scope, budget and timeline
• Drive package definition, technology integration and requirements engineering as part of the project initiation process
• Apply Infineon’s Assembly/Global Change Management (GCM) business process, systematics and project management tools and methods to structure the projects, control, manage risks and changes throughout the project lifecycle
• Responsible for operational decisions in the project and for driving the major milestone release decisions in the project review and approval platform
• Work closely with cross functional project teams from various locations, to solve complex problems and identify innovative solution
• Co-ordinate/support alignment of Subcon Technology roadmaps with segments and representatives of Package Technology and Innovation (PTI) function
• Actively manage the project and pro-actively manage potential deviations to avert delays and additional cost
• Drive package platform assessment between subcons and provide mapping to in-house capability supported by the segments and package platform managers
• Close collaboration with internal partners across various functions and regions, such as from business division, package concept engineering, procurement, IT systems enabling, engineering, planning, quality, procurement, product program management and package platform management
• Technical ramp up management for seamless transition during new product / package ramp up phases into serial production
• Be the driver/co-driver of task force initiatives when situation arise
• Foster good relationship with the resource managers from both internal, subcon business partners and drive cross functional project team members from various locations and nationalities to meet the organization goals through the project

Your Profile

Qualifications and skills to help you succeed

• Master's / Bachelor's in Electrical / Electronic Engineering / Mechanical / Material Science with at least 5 years of experience in Semiconductor Package development/Manufacturing Process Knowhow. Preferably in pre-assembly, assembly, and final test process
• In-depth knowledge in Project Management with more than 5 years experience leading cross-functional projects of significant complexity involving a global team of different nationality
• Preferably with professional IPMA or PMA certification
• Ability to solve complex problems via shaping open mind-set and cooperation in heterogeneous teams; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information
• Strong interpersonal communication and reasoning skills for leading and working in matrix organization of international reach; ability to build long lasting relationships and trusted partnerships
• Willing to travel

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

We are on a journey to create the best Infineon for everyone.
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