Process Engineer - Fremont

Primary Duties & Responsibilities

Process Development & Optimization

• Develop, optimize, and deploy die bonding and wire bonding processes resulting to high reliability
• Establish process parameters for die attach specific for eutectic die bonding and wire bonding applications
• Improve assembly yield, reliability, cycle time, and product performance through in depth data-driven analysis
• Support product development activities from prototype builds through production release

Manufacturing Support

• Provide day-to-day engineering support to production operations
• Troubleshoot process issues related to die placement accuracy, bond integrity, wire pull strength, etc
• Monitor process capability and implement corrective/preventive actions
• Collaborate with operators, technicians, and quality teams to resolve manufacturing challenges

Equipment & Qualification

• Support equipment qualification, calibration, and maintenance of die bonders and wire bonders and other assembly related equipment
• Create and maintain machine programs, recipes, and tooling documentation
• Conduct process validation activities including DOE, GR&R, and capability studies

Documentation & Continuous Improvement

• Prepare work instructions, process flows, process FMEA, control plans, and engineering reports
• Lead continuous improvement projects focused on yield enhancement and cost reduction
• Participate in LEAN manufacturing initiatives

Education & Experience

• At least a bachelor’s degree in Electronics or Electrical engineering or related discipline or courses with at least 3 years of relevant work experience in Semiconductor or Electronics / Opto-electronics and Fiber Optics Industry. Experience on start-up manufacturing and related New Product Introduction activities such product development, process characterization, debug and design reviews, is a plus. Recent college graduate maybe considered thus application is encouraged.
  

Skills

Technical :

• Knowledgeable of eutectic die bonding, gold wire ball bonding techniques, package reliability techniques and equipment
• Experienced on SPC, DOE, FMEA, and industry known root cause analyses
• Able to interpret engineering drawings and process documentations
• Knowledgeable of reliability standards for optoelectronic devices is preferred

Competency:

• Possess strong analytical and problem-solving skills
• Pay attention to details and precision
• Has excellent communication and teamwork abilities
• Able to work in a fast-paced manufacturing environment
• Has mindset of continuous improvement and can work with ambiguity

Working Conditions

• This role is 100% onsite in either the cleanroom or office settings.

Culture Commitment

Ensure adherence to company’s values (ICARE) in all aspects of your position at Coherent Corp.:

Integrity – Create an Environment of Trust

Collaboration – Innovate Through the Sharing of Ideas

Accountability – Own the Process and the Outcome

Respect – Recognize the Value in Everyone

Enthusiasm – Find a Sense of Purpose in Work