Process Engineer – Flip Chip Bonding Process

Job Summary:

We are seeking a motivated and hands-on Process Engineer to support backend semiconductor packaging operations, with primary focus on wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting processes. The successful candidate will provide day-to-day engineering support to meet production output, product quality, efficiency, productivity, yield, cycle time, and safety requirements. This role is ideal for an engineer who enjoys data-driven problem solving, continuous improvement, and working closely with cross-functional teams in a fast-paced manufacturing environment.

Key Responsibilities:

Process Engineering & Manufacturing Support

• Provide engineering support for backend semiconductor packaging processes, including wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting.

• Support daily production activities to achieve output, quality, efficiency, productivity, yield, cycle time, and safety targets.

• Monitor and analyse process data to identify trends, risks, and improvement opportunities.

• Lead troubleshooting and problem-solving activities for process abnormalities, yield loss, quality excursions, and production issues.

• Drive permanent corrective and preventive actions to resolve chronic process and quality issues.

• Evaluate new products, materials, and processes during pilot runs and ensure process readiness for production release.

• Work closely with production, equipment, quality, planning, and cross-functional teams to ensure smooth manufacturing execution.

Documentation, Compliance & Audit Support

• Maintain and ensure the relevance of Work Instructions, Control Plans, FMEA, and Process Control documents.

• Prepare production lines and process documentation for internal and external audits.

• Support audit follow-up actions and ensure timely closure of findings.

• Promote compliance with safety, quality, and manufacturing standards.

Continuous Improvement

• Identify and implement improvement actions to enhance process stability, productivity, yield, and cost effectiveness.

• Apply statistical and quality tools such as SPC, MSA, and structured problem-solving methods where applicable.

• Participate in cross-functional initiatives to improve manufacturing robustness and operational excellence.

Qualifications:

• Bachelor’s Degree in Engineering, preferably in Mechanical, Materials, Chemical, Manufacturing, or a related discipline.

• Preferably at least 2 years of relevant working experience as a Process Engineer in semiconductor assembly or backend manufacturing.

• Fresh graduates with strong technical aptitude and interest in semiconductor manufacturing may also be considered.

Required Skills & Competencies:

• Strong data analysis, problem-solving, and critical thinking skills.

• Good communication and collaboration skills, with the ability to work effectively with cross-functional teams.

• Good planning, organization, and follow-up skills.

• Ability to work under pressure and demonstrate strong commitment to achieving production and quality goals.

• Proficiency in Microsoft PowerPoint, Excel, and Word.

• Knowledge of statistical and quality tools such as SPC and MSA is preferred.

Ideal Candidate Profile:

• A proactive team player who is hands-on, detail-oriented, and comfortable working in a dynamic manufacturing environment.