Process Engineer – Die to Wafer Hybrid Bonding

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

What We Offer

Salary:

$124,000.00 - $171,000.00

Location:

Santa Clara,CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Join the Photonics Platforms Business Group at Applied Materials’ Santa Clara headquarters, where you will work with a cross-functional research team to develop cutting-edge 2.5D/3D advanced packaging technologies.

We are seeking hands‑on Process Engineers to drive die‑to‑wafer (D2W) hybrid bonding R&D. This role focuses on hybrid bonding process development, pathfinding, technology de‑risking, and advanced packaging integration exploration. The role provides on‑the‑job training and hands‑on experience with state‑of‑the‑art equipment, including the industry’s first fully integrated die‑to‑wafer hybrid bonding system.

Key Responsibilities

• Develop die‑to‑wafer hybrid bonding processes, including (but not limited to):
  • Surface preparation and plasma activation
  • High‑accuracy die placement and alignment
  • Post‑bond characterization and process evaluation
• Integrate D2W bonding with adjacent process modules such as:
  • Dicing and die preparation
  • Die thinning
  • Inter‑die gap fill and planarization
• Design and execute DOE‑driven experiments to understand process limits, sensitivities, and trade‑offs.
• Own process optimization, perform failure analysis and characterization, and drive continuous engineering improvement.

Qualifications

• Ph.D. or M.S. in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline.
• In‑depth knowledge and hands‑on experience in one or more of the following:
  • Die‑to‑wafer or wafer‑to‑wafer bonding
  • Thin‑die handling and alignment‑critical processes
  • Micro-LED or CPO experience
  • Heterogeneous integration such as III-V to Si, novel materials to Si
  • 2.5D/3D integration
  • Direct process engineer experience on mainstream semiconductor equipment (plasma, wet clean, overlay/alignment, etc.)
• Strong understanding of:
  • Bond interface physics
  • Alignment and overlay fundamentals
  • Mechanical behavior of thin and fragile dies
• Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP).
• Self‑starter with strong problem‑solving skills; able to work both independently and collaboratively with minimal supervision.
• Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at [email protected], or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.