PCB Layout Engineering Lead

You will own multilayer PCB layout from component placement through fabrication and assembly release. You will define stackups and routing constraints, route high-speed and power circuits, perform design-for-manufacturing checks, create release packages, and support prototypes, bring-up, failure analysis, and production revisions.

Responsibilities

• Own multilayer PCB layout from component placement through fabrication and assembly release
• Translate schematics and requirements into constraint-driven board designs
• Define stackups, controlled-impedance structures, routing rules, and matching constraints
• Place and route high-speed digital, high-current power, and analog circuits
• Apply signal-integrity and power-integrity practices
• Collaborate with engineering, manufacturing, and test partners to resolve layout issues
• Perform design reviews and DFM, DFA, and DFT checks
• Generate and verify fabrication and assembly release packages
• Maintain footprints, padstacks, design libraries, standards, and documentation
• Support prototype builds, board bring-up, failure analysis, and production revisions

Requirements

• Bachelor’s degree in electrical engineering, electronics engineering, a related field, or equivalent practical experience
• 10+ years of complex high-speed multilayer PCB layout experience
• Cadence Allegro PCB Designer and Constraint Manager expertise
• Knowledge of controlled-impedance routing, differential pairs, length matching, return paths, and power distribution
• Experience with BGA escape routing, HDI structures, blind and buried vias, microvias, via-in-pad, and backdrilling
• Knowledge of signal integrity, power integrity, EMI/EMC, thermal design, and high-current routing
• IPC standards and manufacturability-requirements experience
• Ability to create and review PCB fabrication and assembly release packages
• Server or AI accelerator hardware experience

Benefits

• Bonus
• Equity