NPI Manufacturing Engineer (PCBA)

NPI Manufacturing Engineer (PCBA)

This role has been designed as 'Hybrid' with a requirement that you will work on average 2 days per week from an HPE office.

Job Description:

The NPI Manufacturing Engineer (PCBA) is responsible for partnering with R&D, Supply Chain, Quality, Test Engineering, and manufacturing partners to successfully introduce new products into volume production. This role serves as the primary manufacturing engineering representative for New Product Introduction (NPI) programs, driving Design for Manufacturing (DFM), process readiness, prototype build execution, and production ramp activities for complex printed circuit board assemblies (PCBAs).

The engineer leads manufacturability assessments, collaborates with internal and outsourced manufacturing partners, and develops solutions to improve quality, yield, cycle time, cost, and reliability throughout the product lifecycle. The role requires strong technical expertise in PCB fabrication, PCBA assembly processes, and manufacturing problem-solving, along with the ability to influence cross-functional teams and suppliers globally.

Key Responsibilities

• Serve as the primary manufacturing engineering representative on NPI teams for complex PCBA-based products from concept through production ramp and sustaining.
• Lead Design for Manufacturing (DFM) reviews to ensure PCBAs and PCB designs meet manufacturing, quality, reliability, and cost objectives.
• Collaborate with R&D, Signal Integrity, PCB suppliers, Test Engineering, Quality, and Operations teams to optimize product designs for manufacturability and testability.
• Support the development of PCB stack-ups and manufacturing requirements in coordination with design and supplier teams.
• Coordinate and lead activities with internal teams and outsourced manufacturing partners to ensure successful product launches and production readiness.
• Evaluate prototype builds and early production runs, identifying manufacturing risks and implementing corrective actions.
• Analyze manufacturing, quality, test, reliability, and customer feedback data to identify opportunities for product and process improvements.
• Perform engineering analysis and root cause investigations for defective products, assemblies, and manufacturing process failures.
• Drive resolution of PCBA and PCB manufacturing issues related to SMT, BGA assembly and rework, wave soldering, press-fit technologies, component qualification, and new package introductions.
• Develop, monitor, and support Design of Experiments (DOE) activities to optimize manufacturing processes and validate critical process parameters.
• Improve yield, cycle time, product quality, and manufacturing scalability while reducing cost and lead time.
• Communicate manufacturing risks, findings, and recommendations to project stakeholders and management teams.
• Represent the manufacturing engineering organization during design reviews, factory readiness reviews, supplier engagements, and product qualification activities.

Required Qualifications

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Industrial Engineering, or related technical discipline. Master's degree preferred.
• 4-6 years of experience in electronics manufacturing, with significant experience supporting NPI programs for complex PCBAs and electronic systems.
• Experience working with OEM product development teams and/or Electronics Manufacturing Services (EMS) partners.
• Demonstrated experience supporting new product introduction from prototype through production ramp.
• Strong understanding of PCBA manufacturing processes and technologies.
• Advanced English Level

Preferred Qualifications

• Experience with server, networking, storage, telecommunications, or other complex electronics products.
• Knowledge of PCB CAD design practices, PCB fabrication technologies, and stack-up development.
• Experience working with global manufacturing and supplier organizations.
• Familiarity with high-volume manufacturing and process qualification methodologies.
• Lean manufacturing, Six Sigma, or continuous improvement training/certification.

Technical Skills

• Strong knowledge of PCBA manufacturing processes including:
  • SMT assembly
  • BGA assembly and rework
  • Wave soldering
  • Press-fit technologies
  • Rework and repair processes
  • Component qualification and introduction
• Understanding of PCB fabrication technologies, materials, and stack-up design.
• Knowledge of IPC standards, particularly IPC-A-610.
• Experience with DFM, DFT, PFMEA, DOE, and manufacturing process validation techniques.
• Strong statistical analysis, root cause analysis, and problem-solving skills.
• Ability to evaluate manufacturing yield, quality, reliability, and cost performance metrics.
• Proficiency with engineering tools and software for product evaluation, manufacturing analysis, and process improvement.

Travel

• Domestic and international travel may be required, typically up to 10%, to support supplier reviews, factory readiness activities, production launches, and issue resolution.

Accessibility

HPE is committed to creating an inclusive and accessible workplace and encourages applications from all qualified individuals, including those with disabilities. If you believe you require accommodation during any stage of the application or interview process, please submit your request by completing our secure form linked here.

Note: This option is reserved for applicants needing assistance/reasonable accommodation related to a disability.

Health & Wellbeing

We strive to provide our team members and their loved ones with a comprehensive suite of benefits that supports their physical, financial and emotional wellbeing.

Personal & Professional Development

We also invest in your career because the better you are, the better we all are. We have specific programs catered to helping you reach any career goals you have — whether you want to become a knowledge expert in your field or apply your skills to another division.

Unconditional Inclusion

We are unconditionally inclusive in the way we work and celebrate individual uniqueness. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good.

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Job:

Engineering

Job Level:

TCP_03

Hewlett Packard Enterprise is EEO Protected Veteran/ Individual with Disabilities.

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