NCG 3D Heterogeneous Integration Engineer-Cryogenic 3D packaging

About GF

GlobalFoundries® Inc. (GF®) is one of the world's leading semiconductor manufacturers. GF redefines innovation and semiconductor manufacturing by developing and delivering feature-rich process technology solutions with leading performance in all growth markets. GF offers a unique mix of design, development and manufacturing services. With a talented and diverse team and manufacturing locations in the U.S., Europe and Asia, GF is a trusted technology provider to its global customers. GF employs approximately 13,000 people, including more than 3,000 in Dresden, Germany.

For more information, visit www.gf.com.

Introduction

The New Graduate College candidate will join the GlobalFoundries GF Labs organization to support cryogenic 3D packaging and system co-optimization research and development. The candidate will have a 3-year local contract assignment at IMEC in Leuven, Belgium with a path to GlobalFoundries USA (either Malta, NY or Burlington, VT). During the 3-year assignment at IMEC, the candidate is expected to support GlobalFoundries’ technology development focus within the IMEC Industrial Affiliation Programs in Cryogenic and Superconducting 3D Packaging and Cross-system Technology Co-development, including hands-on experiments, integration and system analysis. Additionally, the candidate will organize and lead joint-development projects at IMEC for learning and technology transfer to respective GlobalFoundries R&D team (Advanced Packaging Lab). Post doctoral candidates are welcome to apply.

Essential Responsibilities

• Learn and transfer advanced packaging integration flows (TSV/TOVs, die to wafer bonding, wafer to wafer bonding, interposer, etc.) from IMEC Program to internal GF R&D.

• Learn the system architecture and their requirements to develop expected cryogenic 3D pkg solutions.

• Own and drive bi-lateral projects between Globalfoundries and IMEC.

• Build and maintain relationships with semiconductor 3D material and tooling vendors.

• Contribute to Intellectual Property by writing innovative invention disclosures.

• Contribute to publications and conferences with scientific results.

• Understand application domains for 3D advanced packaging like Artificial Intelligence, Silicon Photonics transceiver/interposer, RF interposers, and quantum computing.

• Understand from IMEC 3D pkg ecosystem the pathfinding areas for new materials (e.g. slurries for CMP, III-Vs, cryogenic and superconducting materials, etc.) and new integration schemes e.g. die detachment or die-to-die bonding.

Other Responsibilities

• Support preparation of summaries and program feedback to IMEC after Partner Technical Weeks (April, October).

• Contribute to executive readouts from IMEC.

• Initiate and run Technical Update sessions in particular technical domains of interest.

• Scout 3D program elements that are ready for technology transfer to GlobalFoundries, e.g. simulation models or design platforms.

Required Qualifications

• Education – technology-related degree (PHD preferred) in Physics, Electrical Engineering, Chemistry, Computer Engineering, Materials Science, Chemical Engineering or other related engineering or physical sciences disciplines.

• Fluent in Microsoft Office applications: MS Excel, MS Word, MS PowerPoint, Outlook, Teams.

• Ability to work effectively and efficiently with diverse teams, customers, internal and external partners.

• Language Fluency - English (Written & Verbal).

• Excellent interpersonal skills, energetic and self-starter. Demonstrated ability to use these attributes in conflict resolution if required.

• Demonstrated ability to efficiently solve problems and provide clear guidance on critical decisions.

Preferred Qualifications

• Systems partitioning expertise for optimization of product form factor for performance, definition of interconnect strategy (Heterogeneous Integration, electrical D2D, broadband surface coupling, etc.) to guide technology development and partner selection (Corporations, Universities and/or Research Institutes).

• Design of electrical test structures for interconnects and packages.

• Project management skills - i.e., the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.

• Strong written and verbal communication skills.

• Strong planning and organizational skills.