FY27 Intern - Low-Power AI, Audio, and Sensors Subsystem Engineering Internship - ASIC Design / Verification/Implementation - Canada (12 or 16 months)

About Qualcomm

Qualcomm relentlessly innovates transforming businesses, enriching lives and fortifying societies. Our solutions are pivotal in crafting a smarter, interconnected world. Building on our nearly 40-year history of era-defining technology breakthroughs, we deliver leading-edge AI, high performance, lower-power computing, and unrivaled connectivity. We’re proud to be the partner of choice to many of the world’s largest enterprises. Together with our ecosystem partners, we enable next-generation digital transformation. At Qualcomm, we are engineering human progress.

Join Us in Shaping the Future

At Qualcomm, we're committed to engineering human progress by delivering intelligent computing everywhere. We're passionate about harnessing the power of technology to transform industries and improve lives. Our early career programs offer limitless opportunities for growth, mentorship, and meaningful work. By joining our team, you'll be part of a community that's pushing the boundaries of what's possible in AI, computing, and connectivity. With a global footprint spanning over 30 countries, you'll have the chance to collaborate with diverse talent and contribute to projects that are shaping the future of technology.

Our early career programs are designed to attract inventive minds, offering a platform to contribute to our long-term innovation pipeline. You'll be part of a community that values collaboration, creativity, and continuous learning. Our programs provide real-world experience, technical skills, and professional development opportunities, empowering you to make a meaningful impact and achieve your career goals. Join us for our 2027 intern class in Markham, Canada!

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Role Overview

The low-power AI, Audio, and Sensors Subsystem is at the heart of nearly every product that Qualcomm delivers, enabling our devices to hear, see, sense, and interact with the world around you, through an intelligent HW ecosystem that enables lightning-fast response times (i.e. “Ok Google”), while maintaining ultra-low power and area footprint

Ubiquitous across Qualcomm’s vast product lines from our Snapdragon Mobile processors to Wearable technology including Smart Watches, Smart Glasses, AR, VR headsets, ultra-portable Bluetooth and personal assistants and a host of Automotive Infotainment, telematics and ADAS solutions.

The LPAI /HPASS team designs, verifies and implements both Low-Power and High-Performance sub-systems that fuse audio, sensors, camera and other inputs with AI acceleration to deliver ultra-low power, always-on, context-aware and intelligent functionality to all of Qualcomm’s ASICs.

As an ultra-low power subsystem, we innovate by enabling new functionality and use cases and optimizing for power with scalable performance for the Mobile, IOT, Wearables and AR/VR market.

Similarly, our High-Performance AI and Audio Subsystem ( HPASS) fuses the same compelling IPs into HW solutions designed for Autonomous Driving ( ADAS ), In-vehicle-infotainment and Telematics

As an intern on our team, you will work closely with an experienced engineer and contribute hands-on to design, verification, and modelling of ASIC HW IP (blocks) and sub-systems and learn a wide range of leading edge low-power and multi-power domain hardware design and verification techniques.

Minimum Qualifications:

• In study towards a bachelors in one of the following: Electrical Engineering, Computer Engineering, Computer Science or related field . Must have a minimum of one semester of university remaining after the internship concludes. Cannot be graduating before internship begins.

• Knowledge of a programming language and scripting. Preferably some experience with lab equipment - scopes, etc. School projects with FPGAs a nice to have.

• Good communication skills, Teamwork and organizational skills

• Object Oriented Programming (OOP), C, C++, Digital Circuits

• Computer Hardware (Caches, Busses, Memories, Clocking)

Preferred Qualifications:

• UVM, SVTB, System Verilog

• I2S/PCM Protocols

• Mathematics for Machine Learning (Algebra and Geometry )

• Relevant courses in Digital Signal Processing, Digital Filters

• Familiar with Embedded systems and interconnects

• Familiar with perforce and other software development tools

• FPGA fundamentals

• Familiar with Python

Successful candidates will gain experience in one of the following project areas:

For LPAI/HPASS ASIC Design and Implementation, Key Responsibilities/Exposures include:

• Contribute to RTL (Verilog) design for next generation Snapdragon Display Processors.

• Integration of external IP’s and design of interfacing logic into the Display Subsystem.

• Work with the latest sub-micron technology nodes.

• Use industry standard CAD tools for RTL Linting, power analysis, and CDC Analysis. Develop a strong foundation in good digital design practices.

• Participate in experiments to optimize the Display design across power, area, and performance targets.

• Using scripting languages (python) to enhance existing methodologies, automate manual processes, and devise new tools for design development.

For LPAI/HPASS ASIC Design Verification Intern, Key Responsibilities/Exposures include:

• Own IP core level feature verification during the design and development phase of next generation ASICs through C/RTL and Gate Level simulations.

• Learn and get in-depth experiences with Display technologies and advance verification methodology and tools

• Participate in test plan development and execution and verification closure in conjunction with the ASIC teams.

• Contribute to creating/maintaining a test bench, assertions, and functional coverage models.

• Contribute to implementing flows to automate development processes.

• Participate in debug activities throughout the development cycle.

• Explore the capabilities of our simulation tools to help improve our DV workflow and simulation performance

Education Requirements:

• In study towards a bachelor’s degree in one of the following: Electrical Engineering, Computer Engineering, Engineering Science, Computer Science, or related field

• For 16-month internships: must be available May/June 2027 - August/September 2028

• For 12-month internships: must be available May/June 2027 - May/June 2028

• Expected graduation date of November 2028 or later.

• 1+ years of academic experience with programming languages such as C, C++, Python, etc

Qualcomm’s Internship Program

Our interns join world-class teams to help define and build what is next for mobility and the world. You’ll be paired with a mentor with visibility to your project and team, receive support from your manager, and have access to the entire Qualcomm employee community to ensure your success. To round out your internship, we host professional development workshops, social events, cross-functional speaker sessions, and an executive speaker series. In addition to competitive hourly pay and accrued vacation time, you will receive housing stipend to accommodate for the duration of your internship.

Application Process

We will review resumes on an ongoing basis, and a recruiter may reach out to you. Advancing candidates may be invited to complete a timed HackerRank challenge to evaluate their technical skill set.

Export Control Notice

This role may require an export license for candidates with citizenship in certain countries (see current country list below – subject to change). Qualcomm, like other companies, is experiencing significant delays in the export license process. Please be advised that if an export license is required, you may not be able to start work with Qualcomm until the license is granted, which may impact your ability to participate in the internship.

Countries requiring export: Armenia, Azerbaijan, Belarus, Burma (Myanmar), Cambodia, China, Cuba, Georgia, Hong Kong, Iran, Iraq, Kazakhstan, Kyrgyzstan, Laos, Libya, Macau, Moldova, Mongolia, Nicaragua, North Korea, Russia, Sudan, Syria, Tajikistan, Turkmenistan, Ukraine, Uzbekistan, Venezuela, Vietnam, and Yemen.