PCB development: Develop multilayer PCBs from requirements through schematic capture, layout, design review, fabrication outputs, assembly support, and final release.
Circuit design: Design and review analog, digital, mixed-signal, power, RF, and processor-based circuits using appropriate analysis, simulation, and engineering calculations.
Power electronics: Design power input stages, DC-DC converters, linear regulators, battery interfaces, protection circuits, filtering, grounding, current sensing, and power distribution networks.
RF communication: Develop PCB sections for wireless communication, including impedance-controlled routing, RF component placement, antenna interfaces, matching networks, filtering, grounding, isolation, and connector selection.
High-speed design: Route high-speed buses and interfaces using controlled impedance, differential pairs, length matching, return-path management, stack-up planning, termination, and signal-integrity principles.
Microprocessor routing: Design processor and microcontroller boards with reliable routing for clocks, memory, high-speed peripherals, power rails, reset, boot, debug, programming, and decoupling networks.
Component libraries: Create and maintain schematic symbols, PCB footprints, 3D associations, pin mappings, courtyard and assembly details, and land patterns for custom or non-standard components.
Engineering documentation: Prepare and maintain design calculations, schematics, bill of materials, fabrication and assembly drawings, stack-up requirements, test procedures, design-review records, and revision history.
Prototype validation: Support board bring-up, debug hardware faults, conduct functional and electrical testing, verify interfaces and power rails, and document corrective actions.
Production support: Work with PCB fabricators, assembly partners, suppliers, and internal teams to resolve manufacturability, assembly, component, and field issues.
Area
Expected Knowledge and Application
Power integrity
Power-tree design, rail sequencing, decoupling, transient response, grounding, protection, efficiency, current capacity, voltage drop, ripple, and thermal performance.
Signal integrity
Trace impedance, differential routing, timing and skew, return paths, crosstalk control, via transitions, termination, and stack-up coordination.
RF design
Transmission-line behavior, RF layouts, matching networks, antenna connections, shielding, filtering, isolation, and practical RF measurement awareness.
Processor systems
Microcontrollers or microprocessors, memory, oscillators, reset and boot circuits, peripheral buses, debug interfaces, and high-density escape routing.
Component engineering
Datasheet interpretation, derating, tolerances, lifecycle and availability checks, approved alternatives, package verification, and library quality control.
Design for manufacture
Fabrication and assembly constraints, panel and test considerations, clearances, drill and via selection, solderability, inspection, and production test access.
Compliance awareness
EMI and EMC design practices, ESD and surge protection, electrical safety, environmental constraints, and applicable product requirements.