[0580] Senior / Mechanical Design Engineer - TCB / Flip-chip / Die-bonding | North/ 5 days/ $9k

Location: Sembawang
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : SGD 6,000 – SGD 9,000/month (Based on experience and technical capability)

Responsibilities:

• Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.
• Develop mechanical concepts, 3D models, detailed drawings, assembly drawings, BOMs, and technical documentation.
• Design equipment modules such as:
• - Wafer handling systems
• - Substrate, strip, panel, or glass-panel handling systems
• - Die ejection, die pickup, and die transfer mechanisms
• - Precision XY, XYZ, XYZT, and multi-axis positioning stages
• - Bondheads and thermal bondheads
• - Micro-Z, force-control, compliance, and tip-tilt mechanisms
• - Heating, cooling, vacuum, gas, and thermal isolation structures
• - Conversion kits, change parts, fixtures, tooling, nests, and bond tools
• Select suitable mechanical and motion components, including bearings, linear guides, motors, encoders, actuators, load cells, heaters, sensors, springs, and flexures.
• Conduct tolerance stack-up and design reviews for critical precision assemblies.
• Consider positioning accuracy, repeatability, structural stiffness, vibration, thermal expansion, force transmission, alignment, and serviceability in the design.
• Work closely with process, electrical, software, vision, motion-control, manufacturing, procurement, and service teams.
• Support machine assembly, alignment, integration, testing, troubleshooting, and customer qualification.
• Investigate machine problems and implement practical design improvements.
• Improve existing modules for better accuracy, reliability, cycle time, manufacturability, and cost.
• Maintain proper engineering documentation and design-change records.

Requirements:

• Diploma or bachelor’s degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or a related discipline.
• Approximately 2 or more years of mechanical design experience in semiconductor equipment, precision automation, machine building, motion systems, or related industries.
• Proficiency in 3D mechanical CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent.
• Able to prepare detailed manufacturing and assembly drawings.
• Good understanding of:
• - Fits and tolerances
• - GD&T
• - Bearings and linear-motion components
• - Machining and fabrication processes
• - Material selection and surface treatment
• - Mechanical assembly and alignment
• Able to develop practical mechanism concepts rather than only produce drawings from instructions.
• Willing to support machine assembly, debugging, testing, and continuous improvement.
• Experience in semiconductor packaging or semiconductor automation equipment.
• Experience designing precision, high-stiffness, or thermally stable machine modules.
• Knowledge of thermal expansion, heater integration, thermal isolation, and temperature uniformity.
• Experience with precision motion, force control, vacuum systems, pneumatics, or cleanroom-compatible equipment.
• Experience with tolerance analysis, FEA, thermal simulation, or structural analysis.
• Experience taking a module from concept through assembly, testing, and customer acceptance.
• Familiarity with DFM, DFA, cost reduction, and engineering change control.
• Experience with prototype, customised, or first-of-a-kind equipment development.

The Supreme HR Advisory Pte. Ltd || 14C7279

Chua Jie Ying (Cai Jie Ying), Evelynn || EA Personnel License R24120580